In short
Controlled bonding for electronics and precision assembly.
Key takeaways
- Low residue and controlled flow
- Thermal stability
- Custom formulations
Clean Application
Stable melt flow improves placement accuracy and reduces rework.
Repeatable Output
Batch consistency helps maintain stable assembly conditions.
Quick Facts
Key parameters and documentation for electronics buyers.
Get a Fast Model Match
Share 3 parameters and our team will respond within 24 hours.
Device Housings
Reliable bonding for plastic and metal housings.
Component Fixation
Controlled placement for delicate parts.
Precision Lines
Clean edge performance for fine assemblies.
Key Parameters for This Line
Typical ranges to speed up selection. Final specs based on substrates and speed.
Set Time
3–8s
Open Time
12–30s
Viscosity @ 60°C
900–1600 cps
Temp Range
-20°C to 120°C
Jelly vs EVA for This Industry
Quick comparison to help your team choose the right adhesive system.
Jelly Adhesive
- Cleaner edges and low stringing
- Stable viscosity for repeatability
- Flexible open-time window
EVA Hot Melt
- Narrower process window
- More cleanup and residue risk
- Performance varies by line speed
Need a Model Recommendation for This Industry?
Share your substrate, line speed, and required set time. We will match a formulation and ship samples quickly.
Helpful Documents
MSDS, RoHS, REACH, and model sheets for procurement review.